Principal Packaging Engineer

As a leading player in the Ultra Wideband (UWB) communications marketplace, Pulse~Link is developing advanced UWB IC's for applications up to 10.6 Ghz. We are searching for an experienced Packaging Engineer to work on IC Package design and development by working with suppliers around the world. We are looking for someone with experience in high frequency packages such as QFN and BGA for RF applications, medium pin-count BGA packages for digital IC's operating at 2.5 Ghz or more. Knowledge in flip-chip packaging and its metallurgy is desirable. Knowledge of organic and/or LTCC substrate design to include passive components such as capacitors and inductors is also desirable. Experience in CSP, SIP, MCM, stacked dies will be useful in solving space/performance issues. In this position you will assist internal IC Design groups for selecting and developing the appropriate packages for their needs, and assist quality/reliability engineering in performing package qualification testing and performing failure analysis as needed.

Working with internal groups, you will be responsible for resolving packaging issues, conducting root cause analysis. You will need to have familiarity with packaging and wire-bond diagrams, and have experience interfacing with board designers for proper IC pad-ring development during IC design phase. You should have knowledge in using thermal analysis and/or EM simulation CAD tools for package design to generate electrical parameters for circuit analysis by designers.

Position Requirements:

BS or MS in Physics or Electrical, Mechanical, Metallurgical Engineering and 5 or more years of experience in Package design in a semiconductor company. You should also be familiar with JEDEC specs and various package fabrication companies.

If you are interested in this position, please E-mail your resume to: careers@pulselink.net or fax it to: 760.607.0861

Pulse~LINK is a privately held corporation headquartered in Carlsbad, California, with approximately 55 employees.